Huawei LogicFolding Chip Claims 54% Density Gain: No Independent Audit Yet

Huawei chip architecture unveils LogicFolding at ISCAS 2026, claiming 53.5% transistor density gains for the Kirin 2026 processor — but no independent auditor has verified the figures, and TSMC hits true 1.4nm three years sooner in 2028.