Imec Demonstrates 200nm Interconnect Pitch Wafer Bonding for CMOS 2.0 Applications

Imec, a research and innovation hub specializing in semiconductor technologies, and EV Group (EVG), a provider of semiconductor manufacturing equipment and process solutions, have presented a wafer-to-wafer hybrid bonding technology. In a press release, imec said the technology was demonstrated at a 200nm Cu interconnect pad pitch on a test vehicle with routable interconnects. The results were presented this week at the 2026 IEEE Electronic Components and Technology Conference (ECTC). The wafer-